• High-performance static CMOS technology
  • Up to 150 MHz (6.67-ns cycle time)
  • 1.9-V/1.8-V core, 3.3-V I/O design
• High-performance 32-bit CPU (TMS320C28x)
  • IEEE 754 single-precision Floating-Point Unit (FPU) (F2833x only)
  • 16 × 16 and 32 × 32 MAC operations
  • 16 × 16 dual MAC
  • Harvard bus architecture
  • Fast interrupt response and processing
  • Unified memory programming model
  • Code-efficient (in C/C++ and Assembly)
• Six-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
• 16-bit or 32-bit External Interface (XINTF)
  • More than 2M × 16 address reach
• On-chip memory
  • F28335, F28333, F28235:
    256K × 16 flash, 34K × 16 SARAM
  • F28334, F28234:
    128K × 16 flash, 34K × 16 SARAM
  • F28332, F28232:
    64K × 16 flash, 26K × 16 SARAM
  • 1K × 16 OTP ROM
• Boot ROM (8K × 16)
  • With software boot modes (through SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)
  • Standard math tables
• Clock and system control
  • On-chip oscillator
  • Watchdog timer module
• GPIO0 to GPIO63 pins can be connected to one of the eight external core interrupts
• Peripheral Interrupt Expansion (PIE) block that supports all 58 peripheral interrupts
• 128-bit security key/lock
  • Protects flash/OTP/RAM blocks
  • Prevents firmware reverse-engineering
• Enhanced control peripherals
  • Up to 18 PWM outputs
  • Up to 6 HRPWM outputs with 150-ps MEP resolution
  • Up to 6 event capture inputs
  • Up to 2 Quadrature Encoder interfaces
  • Up to 8 32-bit timers
    (6 for eCAPs and 2 for eQEPs)
  • Up to 9 16-bit timers
    (6 for ePWMs and 3 XINTCTRs)
• Three 32-bit CPU timers
• Serial port peripherals
  • Up to 2 CAN modules
  • Up to 3 SCI (UART) modules
  • Up to 2 McBSP modules (configurable as SPI)
  • One SPI module
  • One Inter-Integrated Circuit (I2C) bus
• 12-bit ADC, 16 channels
  • 80-ns conversion rate
  • 2 × 8 channel input multiplexer
  • Two sample-and-hold
  • Single/simultaneous conversions
  • Internal or external reference
• Up to 88 individually programmable, multiplexed GPIO pins with input filtering
• JTAG boundary scan support
  • IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
• Advanced emulation features
  • Analysis and breakpoint functions
  • Real-time debug using hardware
• Development support includes
  • ANSI C/C++ compiler/assembler/linker
  • Code Composer Studio™ IDE
  • DSP/BIOS™ and SYS/BIOS
  • Digital motor control and digital power software libraries
• Low-power modes and power savings
  • IDLE, STANDBY, HALT modes supported
  • Disable individual peripheral clocks
• Endianness: Little endian
• Package options:
  • Lead-free, green packaging
  • 176-ball plastic Ball Grid Array (BGA) (ZJZ)
  • 179-ball MicroStar BGA™ (ZHH)
  • 176-pin Low-Profile Quad Flatpack (LQFP) (PGF)
  • 176-pin Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) (PTP)
• Temperature options:
  • A: –40°C to 85°C (PGF, ZHH, ZJZ)
  • S: –40°C to 125°C (PTP, ZJZ)
  • Q: –40°C to 125°C (PTP, ZJZ)
    (AEC Q100 qualification for automotive applications)

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CM GROUP regular Stock:

TMS320F2812PGFA

TMS320F28335PGFA

TMS320C6747DZKBT3

TMS320C6416EGLZA6E

TMS320LF2407APGEA

TMS320C6713BPYPA200